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Low Oxygen Clean Oven Realized “Low Oxygen Concentration: Below 10ppm, Cleanness: Class 10, and Maximum Temperature: 500℃!” FPD-related Equipment → http://www.espec.co.jp/english/products/products04.html Low Oxygen Clean Ovenhas realized the specification which the former Clean Ovens never satisfied! ・Oxygen Concentration: Below 10ppm ・Cleanness: Class 10 ・Temperature Property: Maximum500℃ distribution ±5℃ Usage Examples ●Semiconductor wafers and glass substrates for FPD ●Electronic parts for space and aviation ・For the clean and high-temperature process under the low oxygen concentrate. ・For the substitute for the costly vacuum machines Reconsideration of the process Strong Points exhaust Realized the Low Oxygen Concentration: Below 10ppmOP) The hot wave cycling type altered the common cooling type of introducing air outside into water cooler, and creates an airtight chamber. In addition, the shafts of the blower motor use magnetic seal, and other fixing ports use metal seal, so as to raise the airtightness Special heat-resistant filter Rack in the chamber Glass (600×720mm Secure the High Property of Temperature Distribution ±5.0℃at 500℃ More than 0.30μm More than 0.50μm More than 1.0μm 0.30μm以上 0.50μm以上 1.0μm以上 The simple air conditioning system saves the space. Orchestra baobab made in dakar rar files. It helps to construct the adequate double inner walls and secures the certain air insulation. Setting the water cooler outside of the chamber clears away the unnecessary structure like a dumper. This produces a simple air conditioning system, under which the proper amount of cycling wind secures the temperature distributional property. The oven adopted the materials taken measures for corrosion and thermal expansion. Moreover, this oven’s peculiar construction and the heat-resistant filter realized the cleanness of class 10 (particle 3μm across) during not only the steady temperature period, but also the changing temperature period. It lessens the pile on the specimen during the process. Fig. The 図4 安定500℃運転時のクリーン度 Operation Cleanness under Steady 500℃
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Espec Tsa Manual Download booklad.org - 1 Continuous measurement of micro resistance in solder joint and connector contact areas. Accurate evaluation of the reliability of connections The Conductor Resistance.
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ESPEC TSA-101L-A. Thermal Shock Chamber. Temperature Range-65°C to 200°C. Humidity Range. Windows vista 64 bit indir iso. NA Workspace. 4.00 cubic feet (25' w x 25' h x 18' d) Utilities Required. 220/3/60 60 FLA. Overall Dimensions. 65' wide x 77' high x 60' deep. 90 Days Parts and Labor. CAT.No.E16133-Z1609 Thermal Shock Chamber TSD-101-W TSE-12-A TW10B28C05 (The contents of this catalog is as of September, 2016.) Specifications are subject to change without notice due to design improvements. Corporate names and trade names mentioned in this catalog are trademarks or registered trademarks. Performance Meeting the high performance required by today's test standards Specimen temperature recovery (example) (based on MIL-STD-883 condition C) Test conditions Temperature uniformity measurement method High temp. Exposure: 155 for 30 min. Thermocouples were embedded in 10 ICs Low temp. Exposure: 68 for 30 min. Placed on two levels in each of the corners Specimens: ICs, 10 kg and in the. ESPEC offers a compact, but highly performant thermal shock chamber ideal for the requirements of test standards with small and low-volume specimen. Equipped with superior temperature recovery performance capable of answering the requirements of severe test specifications, this thermal shock model offers a wide test area in a compact, slim design.